MIJING 199°C New High-Purity Tin Paste is a professional-grade, lead-free and silver-free solder paste designed for high-temperature electronic maintenance, particularly for mobile phone motherboard BGA reballing and IC chip repair. This formulation features a 199°C melting point, placing it in the medium-to-high temperature threshold required for stable, long-lasting solder joints on components subjected to significant stress or heat dissipation.
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