MIJING 138°C High-Purity Tin Paste is a premium, lead-free and silver-free low-temperature solder paste. Designed primarily for advanced smartphone and laptop motherboard repairs (like Apple and Huawei BGA/CPU chips), it features an ultra-fine viscosity, strong welding force, and a low melting point of \(138^{\circ }\text{C}\) to prevent heat damage to sensitive components.
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